一种低温下GaN HEMT的噪声建模方法

A noise modeling method for GaN HEMT at low temperatures

  • 摘要: 为了精确模拟低温下氮化镓高电子迁移率晶体管(Gallium Nitride high electron mobility transistor,GaN HEMT)的微波噪声性能,提出了一种基于小信号等效电路构建低温噪声模型的方法. 利用导纳参数的频率依赖性获取小信号等效电路元件,建立了精确的小信号模型. 在此基础上依据Pospieszalski原理对低温噪声源进行表征,特别是栅极泄漏引入的散粒噪声,建立了低温噪声模型. 仿真结果表明:在0.2~40 GHz频段,小信号模型的S参数最大误差为2.5%,在2~10 GHz频段噪声模型的四噪声参数最大误差仅在1%以内. 其中,低温下栅极泄漏散粒噪声贡献约0.1 K,较于传统方法,新方法具有一定的有效性和更高的准确性.

     

    Abstract: In order to accurately simulate the microwave noise performance of Gallium Nitride high electron mobility transistor (GaN HEMT) at low temperature, a method for constructing a low-temperature noise model based on small signal equivalent circuits is proposed. Based on the frequency dependence of the admittance parameters to obtain the equivalent circuit components of the small signal, an accurate small signal model is established, and on this basis, the low-temperature noise sources are characterized according to the Pospieszalski principle, especially the shot noise introduced by gate leakage, and the low-temperature noise model is established. The simulation results show that the maximum error of the S-parameter of the small-signal model is 2.5% in the frequency band of 0.2−40 GHz, and the maximum error of the four-noise parameter of the noise model in the frequency band of 2−10 GHz is only within 1%. Among them, the gate leakage shot noise contribution is about 0.1 K at low temperature, which has a certain effectiveness and accuracy compared with the traditional method.

     

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